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Dicing Saw

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basic information
Categories:
Dicing Saw
Release time:
2019-03-20
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Details

The equipment is suitable for wafer, BGA, QFN and PCB materials. The maximum size of the workpiece is 300mm and the maximum thickness is 2mm. The main machine adopts the structure of the bridge type precision worktable, the double shaft is installed to the right, and the cutting efficiency is high. The main shaft is an air static DC electric spindle. Two fluid efficient cleaning. It has the function of non-contact measuring and cutting, and the operation reliability of the equipment is high. It is equipped with log function, which is easy to query and maintain in the production process.

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